High performance structural sandwich potting compounds
Conference
·
· Sci. Adv. Mater. Process Eng. Proc.; (United States)
OSTI ID:6833075
Requirements for potting compounds used to reinforce the fastener area of the adhesive bonded honeycomb sandwich structure used in aircraft construction are considered, and the development of a family of epoxy materials suitable for this purpose is described. The properties of three potting compounds are outlined. Reported properties included specific gravity, extrusion, slump, ultimate compression strength, flatwise tensile strength, and approximate curing time. The chemistry of epoxy cures is examined with attention to the use of amines and anhydrides as curing agents.
- Research Organization:
- Products Research and Chemical Corp., Glendale, CA
- OSTI ID:
- 6833075
- Report Number(s):
- CONF-780502-
- Conference Information:
- Journal Name: Sci. Adv. Mater. Process Eng. Proc.; (United States) Journal Volume: 23
- Country of Publication:
- United States
- Language:
- English
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