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U.S. Department of Energy
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Microstructure/property relationships for SiC filament-reinforced RBSN. [Reaction-bonded silicon nitride]

Conference · · Ceram. Eng. Sci. Proc.; (United States)
OSTI ID:7170719

Reaction-bonded silicon nitride has been reinforced by SiC filaments. The strength and toughness of this composite is dependent on the microstructure and microchemistry of the fiber/matrix interface. Room temperature flexural strengths of 900 MPa have been observed. Weak interfacial bonding results in shear failure, whereas stronger bonding results in filament fracture and pullout. Auger analysis of the interface reveals that a pure carbon layer is responsible for shear failure. This material shows the highest strength because crack deflection in the carbon layer protects the SiC filament. 18 references.

OSTI ID:
7170719
Report Number(s):
CONF-860152-
Journal Information:
Ceram. Eng. Sci. Proc.; (United States), Journal Name: Ceram. Eng. Sci. Proc.; (United States) Vol. 7; ISSN CESPD
Country of Publication:
United States
Language:
English