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Investigation of ion implantation into high-purity and controllably doped silicon and into gallium arsenide. Final report, January 1982-February 1983

Technical Report ·
OSTI ID:7170546
Data derived from the use of Rutherford backscattering-channelling measurements of disorder production in ion implanted semiconductors for the determination of damage-production mechanisms were analyzed. The redistribution and lattice incorporation of implanted impurities in Si during controlled furnace annealing to reorder the implantation damaged Si were studied. Production of disorder in InP by light- and heavy-ion implantation was investigated as function of implant flux and fluence and implant temperature. Investigation, in parallel with (3) of the damage creation and annealing processes associated with the interaction of the RBS/channeling analysis ion probe with heavy-ion implantation damage in InP is discussed.
Research Organization:
Salford Univ. (UK). Dept. of Electrical Engineering
OSTI ID:
7170546
Report Number(s):
AD-A-172942/5/XAB
Country of Publication:
United States
Language:
English