Deformation and fracture behavior of Sn-5%Sb solder

Journal Article · Tue Nov 01 04:00:00 EST 1994 · Scripta Metallurgica et Materialia; (United States)

DOI:https://doi.org/10.1016/0956-716X(94)90566-5· OSTI ID:7156617

Mahidhara, R K; Sastry, S M.L. ^[1]; Turlik, I ^[2]; Murty, K L ^[3]

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1. Washington Univ., St. Louis, MO (United States)
2. Microelectronics Center of North Carolina, Research Triangle Park, NC (United States)
3. North Carolina State Univ., Raleigh, NC (United States)

Considerable research and development efforts are underway towards the development of lead-free solder alloys. Most of these solders are tin-containing binary and ternary alloys. One such alloy composition that belongs to this category is Sn-5%Sb solder. This solder alloy, with a near-peritectic composition has advantages of good room temperature creep resistance and mechanical strength, although, its melting point is too high (245 C) compared to that of the polar lead-tin eutectic (183 C). An important property of the solder for the manufacturing or product engineer, is wettability. Wettability is solders ability to form the actual joint on a circuit board and is quantitatively assessed by the contact angle formed at the solder-substrate-flux triple point. Compared to a contact angle of 17 [+-] 4[degree] for Pb-Sn eutectic that for Sn-5%Sb is high (43 [+-] 4[degree]) and is adequate for consideration in prototype solder joint development in microelectronics packaging. Mechanical properties, particularly strength and ductility, have been reported by several investigators. In these reports, ductility as high as 80% and 50% have been reported, respectively, at room- and elevated-temperatures (100--225 C). Within the same temperature range the tensile strengths were found to be 40 MPa. This work was performed to study the deformation and fracture characteristics of a fine-grained (< 10[mu]m) Sn-5%Sb solder at various temperatures and strain-rates.

• OSTI ID: 7156617
• Journal Information: Scripta Metallurgica et Materialia; (United States), Journal Name: Scripta Metallurgica et Materialia; (United States) Vol. 31:9; ISSN SCRMEX; ISSN 0956-716X
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360103* -- Metals &amp; Alloys-- Mechanical Properties
ALLOYS
ANTIMONY ALLOYS
DATA
DEFORMATION
EXPERIMENTAL DATA
FILLER METALS
FRACTURE PROPERTIES
GRAIN SIZE
INFORMATION
MECHANICAL PROPERTIES
MICROSTRUCTURE
NUMERICAL DATA
SIZE
TEMPERATURE DEPENDENCE
TIN ALLOYS
TIN BASE ALLOYS