Dislocation punching from ceramic/metal interfaces
Journal Article
·
· Journal of Engineering Materials and Technology; (United States)
- Univ. of Washington, Seattle, WA (United States)
- Tokyo Inst. of Technology, Yokohama (Japan). Dept. of Materials Science and Engineering
Relaxation of misfit strains at interfaces between two different materials by dislocation punching is studied analytically by focusing on two types of interfaces: planar and nonplanar. As an example of planar type interface, the case of metal coating/ceramic substrate system is studied while ceramic filler/metal matrix composite system is examined as an example of a nonplanar interface. Based on the present analytical model, the condition for dislocation punching for each interface is established. Validity of the dislocation punching model is verified by comparing the analytical results with limited experimental results, resulting in a good agreement.
- OSTI ID:
- 7152520
- Journal Information:
- Journal of Engineering Materials and Technology; (United States), Journal Name: Journal of Engineering Materials and Technology; (United States) Vol. 116:3; ISSN 0094-4289; ISSN JEMTA8
- Country of Publication:
- United States
- Language:
- English
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