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Development and application of a corrosion susceptibility test for Ta/sub 2/N--Cr--Au hybrid circuit metallization

Technical Report ·
OSTI ID:7145676
The thrust of this study was to develop and apply a quantitative test measuring the corrosion susceptibility of the hybrid circuit Ta/sub 2/N--Cr--Au metallization. The test chosen used a processing corrosive solution to leach Cr from the metallization; the amount of Cr leached from each metallization variation was measured using atomic absorption spectroscopy analysis on the etchant. The following deposition and handling parameters of the metallization were varied: storage time after deposition, substrate deposition temperature, post deposition high temperature resistor stabilization, Au thickness, and mode of Au deposition. Any one set of processing procedures always resulted in a similar amount of Cr leaching even though there was as much as a 1000 fold difference in Cr leaching for differently deposited and handled metallization. A direct correlation between the resistance to leaching and lead frame bond pull strengths demonstrated the usefulness of this test as an initial screening step in processing.
Research Organization:
Sandia Labs., Albuquerque, N.Mex. (USA)
DOE Contract Number:
E(29-1)-789
OSTI ID:
7145676
Report Number(s):
SAND-76-0414
Country of Publication:
United States
Language:
English