Method of forming superconductive metal layers on electrically nonconductive supports
Patent
·
OSTI ID:7099171
Form superconductive layer of lead or tin on a support by first applying copper layer and then replacing all or part of copper with tin or lead from alkali solution containing tin or lead ions.
- Assignee:
- North American Philips Co., Inc.
- Patent Number(s):
- US 3342631
- OSTI ID:
- 7099171
- Resource Relation:
- Patent Priority Date: Priority date 21 Dec 1962, Netherlands
- Country of Publication:
- United States
- Language:
- English
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