Particle-beam fabrication and in situ processing of integrated circuits

Journal Article · Mon Dec 01 04:00:00 EST 1986 · Proc. IEEE; (United States)

DOI:https://doi.org/10.1109/PROC.1986.13690· OSTI ID:7098686

Steckl, A J

Particle beams, in their broadest context, have become the most common tools in the kit of the IC process engineer. In this paper the general characteristics of particle-beam technologies are systematically classified and critical applications issues are outlined. The uses of ion, electron, and photon beams for various processes (e.g., thin-film deposition, lithography, etching, doping) are reviewed and critical issues are highlighted. The feasibility of integrating several advanced beam processes to achieve a totally in situ process is discussed. Particulate contamination in ''clean''-room environment and under vacuum conditions is addressed and related to chip defects and yield. The relative advantages, in terms of facility and operating cost, flexibility, device performance, of an in situ process are considered.

• Research Organization: Center for Integrated Electronics, and the Dept. of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12181
• OSTI ID: 7098686
• Journal Information: Proc. IEEE; (United States), Journal Name: Proc. IEEE; (United States) Vol. 74:12; ISSN IEEPA
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
BEAMS
CLASSIFICATION
CLEAN ROOMS
CRYSTAL DOPING
ELECTRON BEAM MACHINING
ELECTRON BEAMS
ELECTRONIC CIRCUITS
ETCHING
FABRICATION
FEASIBILITY STUDIES
FILMS
INTEGRATED CIRCUITS
ION BEAMS
LEPTON BEAMS
MACHINING
MICROELECTRONIC CIRCUITS
PARTICLE BEAMS
PARTICLES
PARTICULATES
PERFORMANCE
PHOTON BEAMS
SURFACE FINISHING
TECHNOLOGY ASSESSMENT
THIN FILMS
VACUUM STATES