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U.S. Department of Energy
Office of Scientific and Technical Information

X-ray lithography source

Patent ·
OSTI ID:7083850
A high-intensity, inexpensive X-ray source for X-ray lithography for the production of integrated circuits is disclosed. Foil stacks are bombarded with a high-energy electron beam of 25 to 250 MeV to produce a flux of soft X-rays of 500 eV to 3 keV. Methods of increasing the total X-ray power and making the cross section of the X-ray beam uniform are described. Methods of obtaining the desired X-ray-beam field size, optimum frequency spectrum and eliminating the neutron flux are all described. A method of obtaining a plurality of station operation is also described which makes the process more efficient and economical. The satisfying of these issues makes transition radiation an excellent moderate-priced X-ray source for lithography. 26 figures.
Research Organization:
Adelphia Technology Inc
DOE Contract Number:
AC03-85ER80234
Assignee:
Adelphi Technology Inc., Palo Alto, CA (United States)
Patent Number(s):
A; US 5077774
Application Number:
PPN: US 7-570210
OSTI ID:
7083850
Country of Publication:
United States
Language:
English