Investigation of plasma etch induced damage in compound semiconductor devices
Journal Article
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· Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States)
- Sandia National Laboratories, Albuquerque, New Mexico 87185 (United States)
- School of Electrical Engineering, Purdue University, West Lafayette, Indiana 47907 (United States)
We have investigated the electrical performance of mesa-isolated GaAs [ital pn]-junction diodes to determine the plasma-induced damage effects from reactive ion and reactive ion beam etching (RIBE). A variety of plasma chemistries (SiCl[sub 4], BCl[sub 3], BCl[sub 3]/Cl[sub 2], and Cl[sub 2]) and ion energies ranging from 100 to 400 eV were studied. We have observed that many of the reactive ion etching BCl[sub 3]/Cl[sub 2] plasmas and RIBE Cl[sub 2] plasmas yield diodes with low reverse-bias currents that are comparable to the electrical characteristics of wet-chemical-etched devices. The reverse-bias leakage currents are independent of surface morphology and sidewall profiles.
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 7079711
- Journal Information:
- Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States), Journal Name: Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States) Vol. 12:4; ISSN 0734-2101; ISSN JVTAD6
- Country of Publication:
- United States
- Language:
- English
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Investigation of plasma etch induced damage in compound semiconductor devices
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Inductively Coupled Plasma-Induced Etch Damage of GaN p-n Junctions
Conference
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Sun Oct 31 23:00:00 EST 1993
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OSTI ID:10105186
Plasma-induced damage of GaAs [ital pn]-junction diodes using electron cyclotron resonance generated Cl[sub 2]/Ar, BCl[sub 3]/Ar, Cl[sub 2]/BCl[sub 3]/Ar, and SiCl[sub 4]/Ar plasmas
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Sat Dec 31 23:00:00 EST 1994
· Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States)
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OSTI ID:6870011
Inductively Coupled Plasma-Induced Etch Damage of GaN p-n Junctions
Journal Article
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Tue Nov 02 23:00:00 EST 1999
· Journal of Vacuum Science and Technology A
·
OSTI ID:14382
Related Subjects
665000* -- Physics of Condensed Matter-- (1992-)
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ARSENIC COMPOUNDS
ARSENIDES
BEAMS
BORON CHLORIDES
BORON COMPOUNDS
CHLORIDES
CHLORINE
CHLORINE COMPOUNDS
ELEMENTS
ENERGY RANGE
ETCHING
EV RANGE
EV RANGE 100-1000
GALLIUM ARSENIDES
GALLIUM COMPOUNDS
HALIDES
HALOGEN COMPOUNDS
HALOGENS
ION BEAMS
JUNCTION DIODES
JUNCTIONS
NONMETALS
P-N JUNCTIONS
PHYSICAL RADIATION EFFECTS
PLASMA
PNICTIDES
RADIATION EFFECTS
SEMICONDUCTOR DEVICES
SEMICONDUCTOR DIODES
SEMICONDUCTOR JUNCTIONS
SILICON CHLORIDES
SILICON COMPOUNDS
SILICON HALIDES
SURFACE FINISHING
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ARSENIC COMPOUNDS
ARSENIDES
BEAMS
BORON CHLORIDES
BORON COMPOUNDS
CHLORIDES
CHLORINE
CHLORINE COMPOUNDS
ELEMENTS
ENERGY RANGE
ETCHING
EV RANGE
EV RANGE 100-1000
GALLIUM ARSENIDES
GALLIUM COMPOUNDS
HALIDES
HALOGEN COMPOUNDS
HALOGENS
ION BEAMS
JUNCTION DIODES
JUNCTIONS
NONMETALS
P-N JUNCTIONS
PHYSICAL RADIATION EFFECTS
PLASMA
PNICTIDES
RADIATION EFFECTS
SEMICONDUCTOR DEVICES
SEMICONDUCTOR DIODES
SEMICONDUCTOR JUNCTIONS
SILICON CHLORIDES
SILICON COMPOUNDS
SILICON HALIDES
SURFACE FINISHING