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Investigation of plasma etch induced damage in compound semiconductor devices

Journal Article · · Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States)
DOI:https://doi.org/10.1116/1.579320· OSTI ID:7079711
; ; ; ; ;  [1];  [2]
  1. Sandia National Laboratories, Albuquerque, New Mexico 87185 (United States)
  2. School of Electrical Engineering, Purdue University, West Lafayette, Indiana 47907 (United States)

We have investigated the electrical performance of mesa-isolated GaAs [ital pn]-junction diodes to determine the plasma-induced damage effects from reactive ion and reactive ion beam etching (RIBE). A variety of plasma chemistries (SiCl[sub 4], BCl[sub 3], BCl[sub 3]/Cl[sub 2], and Cl[sub 2]) and ion energies ranging from 100 to 400 eV were studied. We have observed that many of the reactive ion etching BCl[sub 3]/Cl[sub 2] plasmas and RIBE Cl[sub 2] plasmas yield diodes with low reverse-bias currents that are comparable to the electrical characteristics of wet-chemical-etched devices. The reverse-bias leakage currents are independent of surface morphology and sidewall profiles.

DOE Contract Number:
AC04-76DP00789
OSTI ID:
7079711
Journal Information:
Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States), Journal Name: Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States) Vol. 12:4; ISSN 0734-2101; ISSN JVTAD6
Country of Publication:
United States
Language:
English