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Plasma-induced damage of GaAs [ital pn]-junction diodes using electron cyclotron resonance generated Cl[sub 2]/Ar, BCl[sub 3]/Ar, Cl[sub 2]/BCl[sub 3]/Ar, and SiCl[sub 4]/Ar plasmas

Journal Article · · Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States)
DOI:https://doi.org/10.1116/1.587980· OSTI ID:6870011
; ; ; ;  [1];  [2]
  1. Sandia National Laboratories, Albuquerque, New Mexico 87185 (United States)
  2. School of Electrical Engineering, Purdue University, West Lafayette, Indiana 47907 (United States)

Plasma-induced etch damage often degrades the electrical and optical performance of III--V high-density integrated circuits and photonic devices. We have investigated the etch-induced damage of electron cyclotron resonance (ECR) generated plasmas on the electrical performance of mesa-isolated GaAs [ital pn]-junction diodes. Cl[sub 2]/Ar, BCl[sub 3]/Ar, Cl[sub 2]/BCl[sub 3]/Ar, and SiCl[sub 4]/Ar ECR plasmas at ion energies ranging from 10 to 200 eV were studied. Diodes fabricated under low dc-bias ([le]100 V) etch conditions yielded low reverse-bias currents which were comparable to wet-chemical-etched devices. As the dc bias was increased, the diodes showed significantly higher reverse-bias currents indicating plasma-induced sidewall damage of the [ital pn]-junction. Variations in diode reverse-bias leakage currents are reported as a function of plasma parameters and chemistries.

DOE Contract Number:
AC04-94AL85000
OSTI ID:
6870011
Journal Information:
Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States), Journal Name: Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States) Vol. 13:1; ISSN JVTBD9; ISSN 0734-211X
Country of Publication:
United States
Language:
English