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Advanced dielectrics for passivation of InSb

Conference ·
OSTI ID:7076482
A combination of Electron Cyclotron Resonance (ECR) plasma, electrochemical, and chemical growth process were examined to synthesize dielectric surface passivation layers on InSb. The material properties of ECR-grown SiO[sub x]N[sub y] on InSb at temperatures from 30[degrees]C to 250[degrees]C were investigated. Composition analysis was done using Rutherford backscattering spectrometry (RBS) and elastic recoil detection (ERD). The electrical quality of the passivation layer was characterized with capacitance-voltage (CV) measurements on metal-insulator-semiconductor structures over the frequency range from 1 kHz to 1 MHz. Sulfided layers, Si[sub 3]ON[sub 2] on InSb, and sulfided layers capped with S[sub 3]ON[sub 2] all exhibited good C-V properties consistent with interface state densities on the order of 10[sup 11]/cm[sup 2]-eV, and flatband voltages of magnitude less than 1 V. The difference in adhesion of Si[sub 3]N[sub 4] on InSb and the adhesion of Si[sub 3]ON[sub 2] on InSb was described in terms of the strength of the bonding at the dielectric-InSb interface. This work is the first to demonstrate passivation of an InSb surface with high-quality ECR silicon oxynitrides grown at room temperature.
Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
DOE; USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
7076482
Report Number(s):
SAND-92-1593C; CONF-921101--47; ON: DE93005353
Country of Publication:
United States
Language:
English