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Title: Deposition of thin films by ion beam sputtering: Mechanisms and epitaxial growth

Conference · · AIP Conf. Proc.; (United States)
OSTI ID:7063352

In this paper, the capabilities of ion beam sputtering (IBS) to prepare epitaxial layers of various materials are investigated. Thin films (W<0.5 ..mu..m) of silicon, yttria stabilized zirconia (YSZ), tungsten and nickel were deposited using an UHV apparatus equipped with surface analytical tools (RHEED, Auger electron spectrometer). Rare gas ions (Ar, Kr, Xe) of 20 keV energy were used. Silicon homoepitaxial films deposited at temperature above 700/sup 0/C showed structure and electrical properties close to the bulk. Layers of YSZ on Si substrates were deposited by sputtering of a (Y/sub 2/ O/sub 3/)/sub 0.23/ (ZrO/sub 2/)/sub 0.77/ target. Films of good epitaxial quality were grown on Si(100) substrates under partial pressure of oxygen at temperatures in the range 700/sup 0/C--800/sup 0/C. Tungsten silicide and Ni/sub x/GaAs films were prepared by pure metal deposition on heated silicon and GaAs substrates, respectively. Structure and electrical properties of these films have been determined as a function of the deposition temperature. In order to improve the thin film properties, sputtering-related phenomena were studied.

Research Organization:
Institut d'Electronique Fondamentale, Unite Associee au CNRS (AU 22) Universite Paris XI, Bat. 220: 91405 ORSAY-CEDEX (F)
OSTI ID:
7063352
Report Number(s):
CONF-8711124-
Journal Information:
AIP Conf. Proc.; (United States), Vol. 167:1; Conference: Topical conference on deposition and growth: limits for microelectronics, Anaheim, CA, USA, 2 Nov 1987
Country of Publication:
United States
Language:
English

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