Chemical nickel plating in boron-containing solutions at various pH values

Journal Article · Sun Jun 01 04:00:00 EDT 1986 · J. Appl. Chem. USSR (Engl. Transl.); (United States)

OSTI ID:7031886

Prusov, Y V; Selyakov, B A

The authors test dimethylaminoborane solutions and coatings obtained from them. The reducing agent was DMAB made in a pilot plant. The study shows that solutions for chemical nickel plating, containing DMAB as the reducing agent, are very stable at pH from 5 to 9 and temperatures up to 70 deg. The degree of utilization of the reducing agent rises with increase of the solution pH. The deposited coatings have high hardness, adhesion, and soluerability which improve after heat treatment. The solutions used in this study can be recommended for practical use.

• OSTI ID: 7031886
• Journal Information: J. Appl. Chem. USSR (Engl. Transl.); (United States), Journal Name: J. Appl. Chem. USSR (Engl. Transl.); (United States) Vol. 58:12,PT.2; ISSN JAPUA
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360203 -- Ceramics
Cermets
& Refractories-- Mechanical Properties
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
400400* -- Electrochemistry
ADHESION
BORANES
BORON COMPOUNDS
CHEMICAL COATING
CHEMICAL REACTION KINETICS
COATINGS
DEPOSITION
DISPERSIONS
ELECTROCHEMICAL COATING
ELEMENTS
HARDNESS
KINETICS
MECHANICAL PROPERTIES
METALS
MICROHARDNESS
MIXTURES
NICKEL
ORGANIC COMPOUNDS
ORGANOMETALLIC COMPOUNDS
PH VALUE
PROCESS SOLUTIONS
PROTECTIVE COATINGS
REACTION KINETICS
REDOX POTENTIAL
REDUCING AGENTS
SOLUTIONS
SURFACE COATING
TEMPERATURE EFFECTS
TRANSITION ELEMENTS