Flyer plate adhesion tests for copper and nickel plated A286 stainless steel

Journal Article · Mon Dec 01 04:00:00 EST 1975 · Rev. Sci. Instrum.; (United States)

DOI:https://doi.org/10.1063/1.1134149· OSTI ID:7359305

Dini, J W; Johnson, H R

Flyer plate shock wave tests were used to evaluate the influence of using an intermediate copper electrodeposited coating on A286 stainless steel prior to plating to final thickness with nickel. Neither varying the copper plating solution (cyanide or pyrophosphate) nor the deposit thickness from 0.008 to 0.084 mm affected the adhesion.

• Research Organization: Sandia Labs., Livermore, CA
• OSTI ID: 7359305
• Journal Information: Rev. Sci. Instrum.; (United States), Journal Name: Rev. Sci. Instrum.; (United States) Vol. 46:12; ISSN RSINA
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101* -- Metals & Alloys-- Preparation & Fabrication
ADHESION
ALLOY-A-286
ALLOYS
ALUMINIUM ADDITIONS
ALUMINIUM ALLOYS
CHROMIUM ALLOYS
COATINGS
COPPER
DEPOSITION
ELECTRODEPOSITED COATINGS
ELECTRODEPOSITION
ELECTROLYSIS
ELECTROLYTES
ELECTROPLATING
ELEMENTS
HEAT RESISTING ALLOYS
LYSIS
METALS
MOLYBDENUM ALLOYS
NICKEL
NICKEL ALLOYS
PLATING
SURFACE COATING
TITANIUM ALLOYS
TRANSITION ELEMENTS