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U.S. Department of Energy
Office of Scientific and Technical Information

Etching process for improving the strength of a laser-machined silicon-based ceramic article

Patent ·
OSTI ID:7029064
A process is disclosed for improving the strength of laser-machined articles formed of a silicon-based ceramic material such as silicon nitride, in which the laser-machined surface is immersed in an etching solution of hydrofluoric acid and nitric acid for a duration sufficient to remove substantially all of a silicon film residue on the surface but insufficient to allow the solution to unduly attack the grain boundaries of the underlying silicon nitride substrate. This effectively removes the silicon film as a source of cracks that otherwise could propagate downwardly into the silicon nitride substrate and significantly reduce its strength. 1 figure.
DOE Contract Number:
AC05-84OR21400
Assignee:
University of Southern California, Los Angeles, CA (United States)
Patent Number(s):
A; US 5022957
Application Number:
PPN: US 7-414906
OSTI ID:
7029064
Country of Publication:
United States
Language:
English