Evaluations of new polyimide films for flexible circuit applications at EG G Mound Applied Technologies

Conference · Mon Jan 01 04:00:00 EST 1990

OSTI ID:7020104

Williams, M K; Huelskamp, M; Brandon, J; Fisher, M ^[1]; Smith, A ^[2]; Wittberg, T ^[3]

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1. EG and G Mound Applied Technologies, Miamisburg, OH (USA)
2. Sandia National Labs., Albuquerque, NM (USA)
3. Dayton Univ., OH (USA)

Until recently, flexible cable development and production at Mound had to rely heavily on Kapton polyimide from Dupont. The availability of new polyimide films has provided the opportunity to evaluate alternatives to Kapton for our flexible cable work. This paper describes the initial evaluations of the Upilex polyimides, Upilex-S, R, and SGA, distributed by ICI and Apical polyimide distributed by Allied Signal. The new polyimide films were analyzed, along with Kapton, by scanning electron microscopy/energy dispersion spectroscopy, infrared spectroscopy, and x-ray photoelectron spectroscopy. Relative insulating strengths of the films were determined by high voltage electrical breakdown (HiPot) test. All the films were given a thin metal coating by physical vapor deposition, and the metal to polyimide adhesion was tested. Actual test cables were made using Upilex-S as a bridge material. These cables were fired and flyer performance was compared to that of flyers made from Kapton. The new polyimide films not only compare well to Kapton in all areas but also show some advantages in certain applications. 2 figs., 3 tabs.

• Research Organization: EG and G Mound Applied Technologies, Miamisburg, OH (USA)
• Sponsoring Organization: DOE/DP
• DOE Contract Number: AC04-88DP43495
• OSTI ID: 7020104
• Report Number(s): MLM-3644(OP); CONF-9006121--7; ON: DE90014117
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360601 -- Other Materials-- Preparation & Manufacture
360603 -- Materials-- Properties
42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
BREAKDOWN
CABLES
COMPARATIVE EVALUATIONS
CONDUCTOR DEVICES
DIELECTRIC MATERIALS
ELECTRIC CABLES
ELECTRICAL EQUIPMENT
ELECTRICAL INSULATION
ELECTRICAL PROPERTIES
ELECTRON MICROSCOPY
EQUIPMENT
FAILURE MODE ANALYSIS
FILMS
FLEXIBILITY
FLUIDS
GASES
INFRARED SPECTRA
MATERIALS
MECHANICAL PROPERTIES
MICROSCOPY
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PERFORMANCE TESTING
PETROCHEMICALS
PETROLEUM PRODUCTS
PHYSICAL PROPERTIES
POLYMERS
RESINS
SPECTRA
SPECTROSCOPY
SUBSTRATES
SYSTEM FAILURE ANALYSIS
SYSTEMS ANALYSIS
TENSILE PROPERTIES
TESTING
VAPORS
VELOCITY
X-RAY SPECTROSCOPY