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Title: Evaluations of new polyimide films for flexible circuit applications at EG G Mound Applied Technologies

Conference ·
OSTI ID:7020104
; ; ;  [1];  [2];  [3]
  1. EG and G Mound Applied Technologies, Miamisburg, OH (USA)
  2. Sandia National Labs., Albuquerque, NM (USA)
  3. Dayton Univ., OH (USA)

Until recently, flexible cable development and production at Mound had to rely heavily on Kapton polyimide from Dupont. The availability of new polyimide films has provided the opportunity to evaluate alternatives to Kapton for our flexible cable work. This paper describes the initial evaluations of the Upilex polyimides, Upilex-S, R, and SGA, distributed by ICI and Apical polyimide distributed by Allied Signal. The new polyimide films were analyzed, along with Kapton, by scanning electron microscopy/energy dispersion spectroscopy, infrared spectroscopy, and x-ray photoelectron spectroscopy. Relative insulating strengths of the films were determined by high voltage electrical breakdown (HiPot) test. All the films were given a thin metal coating by physical vapor deposition, and the metal to polyimide adhesion was tested. Actual test cables were made using Upilex-S as a bridge material. These cables were fired and flyer performance was compared to that of flyers made from Kapton. The new polyimide films not only compare well to Kapton in all areas but also show some advantages in certain applications. 2 figs., 3 tabs.

Research Organization:
EG and G Mound Applied Technologies, Miamisburg, OH (USA)
Sponsoring Organization:
DOE/DP
DOE Contract Number:
AC04-88DP43495
OSTI ID:
7020104
Report Number(s):
MLM-3644(OP); CONF-9006121-7; ON: DE90014117
Resource Relation:
Conference: 4. international SAMPE electronic materials and processes conference, Albuquerque, NM (USA), 12-14 Jun 1990
Country of Publication:
United States
Language:
English