New flexible circuit material evaluation
A project has been undertaken to evaluate new sources of flexible circuit materials for use by Allied-Signal, Inc., Kansas City Division. The vast majority of current flexible circuits are fabricated from polyimide film and acrylic adhesive circuit materials. One new polyimide film was evaluated as an alternate dielectric film. Thirteen (13) suppliers of flexible circuit materials have been identified. The results of the mechanical and electrical properties evaluation study of some of the new sources of flexible circuit materials are discussed. 5 tabs.
- Research Organization:
- Allied-Signal Aerospace Co., Kansas City, MO (USA). Kansas City Div.
- Sponsoring Organization:
- DOE/DP
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 7002224
- Report Number(s):
- KCP-613-4303; CONF-9006121--3; ON: DE90008313
- Country of Publication:
- United States
- Language:
- English
Similar Records
Flexible circuit registration improvements
Development of discrete components. Final report
Evaluations of new polyimide films for flexible circuit applications at EG G Mound Applied Technologies
Technical Report
·
Wed Jan 31 23:00:00 EST 1990
·
OSTI ID:5109921
Development of discrete components. Final report
Technical Report
·
Tue Oct 31 23:00:00 EST 1995
·
OSTI ID:150934
Evaluations of new polyimide films for flexible circuit applications at EG G Mound Applied Technologies
Conference
·
Sun Dec 31 23:00:00 EST 1989
·
OSTI ID:7020104
Related Subjects
36 MATERIALS SCIENCE
360603 -- Materials-- Properties
42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
ADHESIVES
ELECTRICAL PROPERTIES
ELECTRONIC CIRCUITS
EVALUATION
FABRICATION
FILMS
FLEXIBILITY
IMIDES
MECHANICAL PROPERTIES
MICROELECTRONIC CIRCUITS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
PHYSICAL PROPERTIES
POLYMERS
TENSILE PROPERTIES
THIN FILMS
360603 -- Materials-- Properties
42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
ADHESIVES
ELECTRICAL PROPERTIES
ELECTRONIC CIRCUITS
EVALUATION
FABRICATION
FILMS
FLEXIBILITY
IMIDES
MECHANICAL PROPERTIES
MICROELECTRONIC CIRCUITS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
PHYSICAL PROPERTIES
POLYMERS
TENSILE PROPERTIES
THIN FILMS