Dynamic recrystallization in high-strain, high-strain-rate plastic deformation of copper
- Univ. of California, San Diego, La Jolla, CA (United States). Dept. of Applied Mechanics and Engineering Science
When copper is deformed to high plastic strain ([gamma] [approximately]3--4) at high strain rates ([dot [gamma]] [approximately] 10[sup 4] s[sup [minus]1]) a microstructure with grain sizes of [approximately]0.1 [mu]m can be produced. It is proposed that this microstructure develops by dynamic recrystallization, which is enabled by the adiabatic temperature rise. By shock-loading the material, and thereby increasing its flow stress, the propensity for dynamic recrystallization can be enhanced. The grain size-flow stress relationship observed after cessation of plastic deformation is consistent with the general formulation proposed by Derby. The temperatures reached by the specimens during dynamic deformation are calculated from a constitutive equation and are found to be, for the shock-loaded material, in the 500--800 K range; these temperatures are consistent with static annealing experiments on shock-loaded specimens, that show the onset of static recrystallization at 523 K. A possible recrystallization mechanism is described and its effect on the mechanical response of copper is discussed.
- OSTI ID:
- 6987360
- Journal Information:
- Acta Metallurgica et Materialia; (United States), Journal Name: Acta Metallurgica et Materialia; (United States) Vol. 42:9; ISSN 0956-7151; ISSN AMATEB
- Country of Publication:
- United States
- Language:
- English
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