Circuit level modeling and parameterization of integrated circuit structures

Book · Wed Jan 01 04:00:00 EST 1986

OSTI ID:6968623

Moinian, S

The details of the structure and the underlying physical models for a computer-based solid-state device parameter extractor for SPICE (1), ICEPAR (Integrated Circuit Extraction of PARameters), based on IC fabrication process flow is described. These solid state devices currently include, Bipolar Junction Transistors (BJT's), junction diodes, and semiconductor resistors of almost arbitrary shapes. A detailed explanation is offered to demonstrate the capability of the ICEPAR software to control the terminal electrical characteristics of either a device or a complete integrated circuit, through variation of IC process parameter. In particular, procedures to subdivide the IC structure into a network of lumped simple-device regions are developed. The particular structures and geometrical specifications defining those regions and the methodology for assigning impurity concentration profiles to the corresponding regions is explained thoroughly. Subsequently, physically based mathematical models defining the SPICE parameters of the lumped devices are offered.

• Research Organization: University of Southern California, Los Angeles (USA)
• OSTI ID: 6968623
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
99 GENERAL AND MISCELLANEOUS
990200 -- Mathematics & Computers
COMPUTERIZED CONTROL SYSTEMS
CONTROL SYSTEMS
ELECTRONIC CIRCUITS
FABRICATION
INTEGRATED CIRCUITS
MATHEMATICAL MODELS
MICROELECTRONIC CIRCUITS
PARAMETRIC ANALYSIS
SEMICONDUCTOR DEVICES