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Title: Ar incorporation in epitaxial TiN films deposited by reactive magnetron sputtering in mixed Ar/N/sub 2/ discharges

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.100014· OSTI ID:6957640

TiN films were grown on (100), (110), and (111) oriented MgO by reactive magnetron sputtering from a Ti target in mixed Ar/N/sub 2/ discharges. During film growth at substrate temperatures T/sub s/ ranging from 450 to 900 /sup 0/C, an applied negative substrate bias V/sub s/ (0less than or equal toV/sub s/less than or equal to600 V) was used to vary the flux and energy of impinging Ar/sup +/ and N/sup +//sub 2/ ions. Electron channeling and transmission electron microscopy were used to show that films grown at T/sub s/greater than or equal to550 /sup 0/C were epitaxial with a defect density that decreased with increasing T/sub s/. At a constant T/sub s/ = 700 /sup 0/C, the films were found to remain epitaxial as V/sub s/ was increased from 0 to 200 V, but the crystalline quality clearly deteriorated with V/sub s/ = 400 V and at V/sub s/ = 600 V the films were polycrystalline. Energy dispersive x-ray analysis showed that the trapped Ar concentration C/sub Ar/ in the films was a function of both V/sub s/ and T/sub s/. For T/sub s/ = 700 /sup 0/C, C/sub Ar/ increased with increasing V/sub s/ to reach a maximum C/sup max//sub Ar/ at 400 V before decreasing again. The relative value of C/sup max//sub Ar/ varied with orientation in the following manner: (110)>(100)>(111). At a constant V/sub s/ = 400 V, C/sup max//sub Ar/ for (110) oriented films occurred at T/sub s/approx. =750 /sup 0/C. These results are explained based upon ion channeling efficiency as a function of film orientation and defect structure.

Research Organization:
Department of Physics, Linkoeping University, S-581 83 Linkoeping, Sweden
OSTI ID:
6957640
Journal Information:
Appl. Phys. Lett.; (United States), Vol. 53:13
Country of Publication:
United States
Language:
English

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