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Heavy-ion-induced, gate-rupture in power MOSFETs

Conference · · IEEE Trans. Nucl. Sci.; (United States)
OSTI ID:6951822
A new, heavy-ion-induced, burnout mechanism has been experimentally observed in power metal-oxide-semiconductor field-effect transistors (MOSFETs). This mechanism occurs when a heavy, charged particle passes through the gate oxide region of n- or p-channel devices having sufficient gate-to-source or gate-to-drain bias. The gate-rupture leads to significant permanent degradation of the device. A proposed failure mechanism is discussed and experimentally verified. In addition, the absolute immunity of p-channel devices to heavy-ion-induced, semiconductor burnout is demonstrated and discussed along with new, non-destructive, burnout testing methods.
Research Organization:
Sandia National Labs., Albuquerque, NM (US)
OSTI ID:
6951822
Report Number(s):
CONF-8707112-
Conference Information:
Journal Name: IEEE Trans. Nucl. Sci.; (United States) Journal Volume: NS-34:6
Country of Publication:
United States
Language:
English