Surface preparation and plating

Technical Report · Wed Oct 06 04:00:00 EDT 1982

OSTI ID:6950781

Dini, J W; Waldrop, F B; Reno, R W

This chapter covers electroplating and electroless nickel plating since coatings of this type play an important role in diamond turning technology. Items to be discussed include preparation of substrates prior to coating, plating defects such as pits and nodules and their influence on optics, the influence of stress in coatings, plating details for copper, gold, silver, and electroless nickel, and the importance of additives and their influence on grain size and structure of deposits. Some comments are made on future challenges that could be presented to the plating community to further improve the quality of coatings applied for diamond turning purposes. 60 references, 8 figures, 9 tables.

• Research Organization: Lawrence Livermore National Lab., CA (USA); Oak Ridge Y-12 Plant, TN (USA)
• DOE Contract Number: W-7405-ENG-48
• OSTI ID: 6950781
• Report Number(s): UCRL-88199; CONF-820159-1; ON: DE83001190
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101* -- Metals & Alloys-- Preparation & Fabrication
COATINGS
COPPER
CRYSTAL STRUCTURE
DEFECTS
DEPOSITION
ELECTRODEPOSITION
ELECTROLYSIS
ELECTROPLATING
ELEMENTS
GOLD
GRAIN SIZE
LYSIS
MATERIALS
METALS
MICROSTRUCTURE
MIRRORS
NICKEL
OPTICAL SYSTEMS
PLATING
SILVER
SIZE
STRESSES
SUBSTRATES
SURFACE COATING
SURFACE TREATMENTS
TRANSITION ELEMENTS