Plating under reduced pressure
Conference
·
OSTI ID:6586846
- Lawrence Livermore National Lab., CA (United States)
- TRW, Inc., Redondo Beach, CA (United States)
Plating under reduced pressure was evaluated for both electroless nickel and electrodeposited copper systems. The objective was to reduce pitting of these coatings thereby further enhancing their usage for diamond turning applications. Cursory experiments with electroless nickel showed reduced porosity when deposition was done at around 500 torr. Detailed experiments with electrodeposited copper at around 100 torr provided similar results. Scanning tunneling microscopy was effectively used to show the improvement in the copper deposits plated under reduced pressure. Benefits included reduced surface roughness and finer and denser grain structure.
- Research Organization:
- Lawrence Livermore National Lab., CA (United States)
- Sponsoring Organization:
- DOE; USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 6586846
- Report Number(s):
- UCRL-JC-109782; CONF-9206129--4; ON: DE93011896
- Country of Publication:
- United States
- Language:
- English
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