skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Total dose induced hole trapping in trench oxides

Conference · · IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA)
OSTI ID:6948318
;  [1]; ;  [2]
  1. Mission Research Corp., Albuquerque, NM (US)
  2. Naval Weapons Support Center, Crane, IN (US)

Ionization effects in polysilicon filled trenches used for component isolation in an advanced commercial bipolar technology are examined. Contact to the trench polysilicon was used to sweep the subthreshold characteristics of a parasitic trench field effect transistor formed by the trench and two buried layers. The subthreshold charge separation technique was used to analyze the buildup of trapped holes and interface states. For typical microcircuit layouts, (the trench polysilicon is ground or floating) the irradiation data at a total dose of greater than 1 Mrad(SiO{sub 2}) showed identical saturation of the threshold voltage shift and minimal interface state buildup regardless of the source and drain irradiation bias conditions. However, the radiation responses for the various irradiation bias conditions prior to saturation were significantly different. Discussions on the complex irradiation response and implications for the use of trenched bipolar microcircuits in radiation environments are provided.

OSTI ID:
6948318
Report Number(s):
CONF-890723-; CODEN: IETNA; CNN: N00164-87-D-0010; TRN: 90-014129
Journal Information:
IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (USA), Vol. 36:6; Conference: 26. annual conference on nuclear and space radiation effects, Marco Island, FL (USA), 25-29 Jul 1989; ISSN 0018-9499
Country of Publication:
United States
Language:
English