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Effect of ozone annealing on the dielectric properties of tantalum oxide thin films grown by chemical vapor deposition

Journal Article · · Applied Physics Letters; (USA)
DOI:https://doi.org/10.1063/1.103323· OSTI ID:6910875
;  [1]
  1. Sony Corporation Research Center, 174 Fujitsukacho, Hodogayaku, Yokohama 240, Japan (JP)
Effects of the heat treatment in flowing oxygen containing ozone of 0.5--1 vol % (O{sub 3} annealing) on the dielectric properties of the Ta{sub 2}O{sub 5} thin film (100--200 A) grown on the Si substrate by the chemical vapor deposition method were investigated. The leakage current was drastically reduced from more than 10{sup {minus}3} to 10{sup {minus}9} A/cm{sup 2} in an electric field of 3 MV/cm by the O{sub 3} annealing at 400 {degree}C. It was also found that the leakage current was decreased and increased reversibly between alternate O{sub 3} annealing and O{sub 2} annealing (without ozone). These two states of the leakage current can be attributed to the reproducible change of the oxygen vacancies in the Ta{sub 2}O{sub 5} film.
OSTI ID:
6910875
Journal Information:
Applied Physics Letters; (USA), Journal Name: Applied Physics Letters; (USA) Vol. 56:10; ISSN APPLA; ISSN 0003-6951
Country of Publication:
United States
Language:
English