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Title: Atomic force microscopy, lateral force microscopy, and transmission electron microscopy investigations and adhesion force measurements for elucidation of tungsten removal mechanisms

Abstract

We investigated various interactions between alumina and tungsten films that occur during chemical mechanical polishing (CMP). Atomic force microscopy surface topography measurements of post-CMP tungsten indicate that the roughness of the tungsten is independent of polish pressure and rotation rate. Pure mechanical abrasion is therefore an unlikely mechanism of material removal during CMP. Transmission electron microscopy images corroborate these results. The adhesion force between alumina and tungsten was measured in solution. The adhesive force increased with KIO{sub 3} concentration. Friction forces were measured in solution using lateral force microscopy. The friction force in buffered solutions was independent of KIO{sub 3} concentration. These results indicate that interactions other than purely mechanical interactions exist during CMP. {copyright} {ital 1999 Materials Research Society.}

Authors:
;  [1];  [2]
  1. Department of Chemical and Nuclear Engineering, University of New Mexico, 209 Farris Engineering Center, Albuquerque, New Mexico 87131 (United States)
  2. Microelectronics Development Laboratory, Sandia National Laboratories, MS 1084, P.O. Box 5800, Albuquerque, New Mexico 87185-5800 (United States)
Publication Date:
Research Org.:
Sandia National Laboratory
OSTI Identifier:
690702
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Journal Article
Journal Name:
Journal of Materials Research
Additional Journal Information:
Journal Volume: 14; Journal Issue: 9; Other Information: PBD: Sep 1999
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ALUMINIUM COMPOUNDS; OXYGEN COMPOUNDS; FILMS; TUNGSTEN; ALUMINIUM OXIDES; POLISHING; ADHESION; SLIDING FRICTION

Citation Formats

Stein, D.J., Cecchi, J.L., and Hetherington, D.L. Atomic force microscopy, lateral force microscopy, and transmission electron microscopy investigations and adhesion force measurements for elucidation of tungsten removal mechanisms. United States: N. p., 1999. Web. doi:10.1557/JMR.1999.0499.
Stein, D.J., Cecchi, J.L., & Hetherington, D.L. Atomic force microscopy, lateral force microscopy, and transmission electron microscopy investigations and adhesion force measurements for elucidation of tungsten removal mechanisms. United States. doi:10.1557/JMR.1999.0499.
Stein, D.J., Cecchi, J.L., and Hetherington, D.L. Wed . "Atomic force microscopy, lateral force microscopy, and transmission electron microscopy investigations and adhesion force measurements for elucidation of tungsten removal mechanisms". United States. doi:10.1557/JMR.1999.0499.
@article{osti_690702,
title = {Atomic force microscopy, lateral force microscopy, and transmission electron microscopy investigations and adhesion force measurements for elucidation of tungsten removal mechanisms},
author = {Stein, D.J. and Cecchi, J.L. and Hetherington, D.L.},
abstractNote = {We investigated various interactions between alumina and tungsten films that occur during chemical mechanical polishing (CMP). Atomic force microscopy surface topography measurements of post-CMP tungsten indicate that the roughness of the tungsten is independent of polish pressure and rotation rate. Pure mechanical abrasion is therefore an unlikely mechanism of material removal during CMP. Transmission electron microscopy images corroborate these results. The adhesion force between alumina and tungsten was measured in solution. The adhesive force increased with KIO{sub 3} concentration. Friction forces were measured in solution using lateral force microscopy. The friction force in buffered solutions was independent of KIO{sub 3} concentration. These results indicate that interactions other than purely mechanical interactions exist during CMP. {copyright} {ital 1999 Materials Research Society.}},
doi = {10.1557/JMR.1999.0499},
journal = {Journal of Materials Research},
number = 9,
volume = 14,
place = {United States},
year = {1999},
month = {9}
}