Investigation of the kinetics of tungsten chemical mechanical polishing in potassium iodate-based slurries. 1: Role of alumina and potassium iodate
- Univ. of New Mexico, Albuquerque, NM (United States). Dept. of Chemical and Nuclear Engineering
- Sandia National Labs., Albuquerque, NM (United States). Microelectronics Development Lab.
The authors investigated aspects of the kinetics of tungsten chemical mechanical polishing (CMP) in iodate-based slurries. Specifically, they performed experiments in which they measured the tungsten polish rate and process temperature as a function of alumina concentration, potassium iodate concentration, platen temperature, polish pressure, polish rotation rate, and pad type. They found that the polish rate data fit a multiterm regression model better than the empirical Preston equation. Polish rate was found to vary with all of the factors investigated. Process temperature varied with all of the factor except potassium iodate concentration. These results, in combination with an energy balance on the entire process, indicate the change in temperature due to alumina concentration is mostly due to energy input from increased shaft work. This implies that the chemical and physical interactions between the alumina and tungsten surfaces are complex and play an important role in the mechanism of tungsten removal during CMP.
- Research Organization:
- Sandia National Laboratory
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 321144
- Journal Information:
- Journal of the Electrochemical Society, Journal Name: Journal of the Electrochemical Society Journal Issue: 1 Vol. 146; ISSN 0013-4651; ISSN JESOAN
- Country of Publication:
- United States
- Language:
- English
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