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Kinetics of solid phase epitaxial regrowth in amorphized Si[sub 0. 88]Ge[sub 0. 12] measured by time-resolved reflectivity

Journal Article · · Applied Physics Letters; (United States)
DOI:https://doi.org/10.1063/1.108892· OSTI ID:6901566
 [1];  [2];  [1]
  1. Department of Materials Science and Engineering, University of Florida, Gainesville, Florida 32611 (United States)
  2. Solid State Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831-6048 (United States)
Time-resolved reflectivity has been used to measure the rate of solid phase epitaxial regrowth (SPER) [ital in] [ital situ] during annealing of strained Si[sub 0.88]Ge[sub 0.12] epilayers on Si preamorphized by the implantation of Si. The SPER velocities were measured over more than two orders of magnitude at temperatures from 503 to 603 [degree]C. The results confirm that the average SPER velocity in thin, strained Si[sub 0.88]Ge[sub 0.12] layers is less than that in pure Si. Furthermore, these real-time measurements demonstrate that the SPER rate for strained Si[sub 0.88]Ge[sub 0.12] alloys is not a constant during regrowth at a fixed temperature but varies systematically as a function of the position of the amorphous-crystalline interface. The activation energy barrier of SPER in strained Si[sub 0.88]Ge[sub 0.12] is higher than that in pure Si and is also a function of interface position, ranging from 2.94 to 3.11 eV. Cross-section transmission electron microscopy shows that strain-relieving defects are introduced coincidentally with the minimum regrowth rate.
DOE Contract Number:
AC05-84OR21400
OSTI ID:
6901566
Journal Information:
Applied Physics Letters; (United States), Journal Name: Applied Physics Letters; (United States) Vol. 62:5; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English