Electronic packaging materials science II
Conference
·
OSTI ID:6885461
This book contains the proceedings of a symposium on electronic packaging materials science. Topics include the following: properties of electron interactive oxide films; materials for electronic packaging; and glass films and interfaces in microelectronic applications.
- OSTI ID:
- 6885461
- Report Number(s):
- CONF-860445-
- Country of Publication:
- United States
- Language:
- English
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