ISTFA 1987 - International Symposium for Testing and Failure Analysis: Microelectronics; Proceedings of the Symposium, Los Angeles, CA, Nov. 9-13, 1987

Conference · Thu Jan 01 00:00:00 EST 1987

OSTI ID:6876286

The papers presented in this volume provide an overview of recent developments in the failure analysis method and techniques used in microelectronics. General topics discussed include GaAs device failure analysis, transmission electron microscopy for failure analysis, EOS/ESD analysis, interconnections and coatings analysis, and failure modes and mechanisms. Papers are included on dominant failure modes in GaAs D-MESFET integrated circuits, TEM sample preparation methods to inspect integrated circuit structures, surface analysis of contamination in thin film coatings, and evaluation of optical fibers for space use.

• OSTI ID: 6876286
• Report Number(s): CONF-8711255-
• Resource Relation: Conference: ISTFA 1987 - international symposium for testing and failure analysis: advanced materials, Los Angeles, CA, USA, 9 Nov 1987
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
MICROELECTRONICS
MEETINGS
ELECTRON MICROSCOPY
FAILURES
FIELD EFFECT TRANSISTORS
GALLIUM ARSENIDES
MICROPROCESSORS
OPTICAL FIBERS
PACKAGING
PROTECTIVE COATINGS
SCHOTTKY BARRIER DIODES
SOLAR CELLS
SOLDERING
TESTING
THIN FILMS
TRANSMISSION ELECTRON MICROSCOPY
ARSENIC COMPOUNDS
ARSENIDES
COATINGS
COMPUTERS
DIRECT ENERGY CONVERTERS
ELECTRONIC CIRCUITS
EQUIPMENT
FABRICATION
FIBERS
FILMS
GALLIUM COMPOUNDS
JOINING
MICROELECTRONIC CIRCUITS
MICROSCOPY
PHOTOELECTRIC CELLS
PHOTOVOLTAIC CELLS
PNICTIDES
SEMICONDUCTOR DEVICES
SEMICONDUCTOR DIODES
SOLAR EQUIPMENT
TRANSISTORS
WELDING
420800* - Engineering- Electronic Circuits & Devices- (-1989)