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U.S. Department of Energy
Office of Scientific and Technical Information

ISTFA 1987 - International Symposium for Testing and Failure Analysis: Microelectronics; Proceedings of the Symposium, Los Angeles, CA, Nov. 9-13, 1987

Conference ·
OSTI ID:6876286
The papers presented in this volume provide an overview of recent developments in the failure analysis method and techniques used in microelectronics. General topics discussed include GaAs device failure analysis, transmission electron microscopy for failure analysis, EOS/ESD analysis, interconnections and coatings analysis, and failure modes and mechanisms. Papers are included on dominant failure modes in GaAs D-MESFET integrated circuits, TEM sample preparation methods to inspect integrated circuit structures, surface analysis of contamination in thin film coatings, and evaluation of optical fibers for space use.
OSTI ID:
6876286
Report Number(s):
CONF-8711255-
Country of Publication:
United States
Language:
English