ISTFA 1986 - International Symposium for Testing and Failure Analysis; Proceedings of the Symposium, Los Angeles, CA, Oct. 20-24, 1986
Conference
·
OSTI ID:5678996
The conference presents papers on the analysis of electronic materials, problems with electronic materials, EOS/ESD, new techniques, failure analysis results, test methods, failure modes and mechanisms, and the effect of microstructure on properties. Topics include the analysis of on-line organic microcontaminants in semiconductor assembly plants, the role of surface chemistry in packaging failures, the testing and analysis of photovoltaic modules for electrochemical corrosion, the reliability improvement and evaluation of TWTs for communications satellites, and the analysis of adhesive bond joint fractures by scanning electron fractography and X-ray emission spectroscopy. Consideration is also given to observers for failure detection of actuation systems, mechanisms governing the high strain fracture behavior of Al-Li-X alloys, and the effect of nonmetallic inclusions and test temperature on the fatigue life of cast C355, 354, and A206 aluminum.
- OSTI ID:
- 5678996
- Report Number(s):
- CONF-8610383-
- Country of Publication:
- United States
- Language:
- English
Similar Records
ISTFA 1987 - International Symposium for Testing and Failure Analysis: Microelectronics; Proceedings of the Symposium, Los Angeles, CA, Nov. 9-13, 1987
ISTFA 1987 - International Symposium for Testing and Failure Analysis: Advanced materials; Proceedings of the Symposium, Los Angeles, CA, Nov. 9-13, 1987
ISTFA 1988 - International Symposium for Testing and Failure Analysis; Proceedings of the Symposium, Los Angeles, CA, Oct. 31-Nov. 4, 1988
Conference
·
Wed Dec 31 23:00:00 EST 1986
·
OSTI ID:6876286
ISTFA 1987 - International Symposium for Testing and Failure Analysis: Advanced materials; Proceedings of the Symposium, Los Angeles, CA, Nov. 9-13, 1987
Conference
·
Wed Dec 31 23:00:00 EST 1986
·
OSTI ID:6893530
ISTFA 1988 - International Symposium for Testing and Failure Analysis; Proceedings of the Symposium, Los Angeles, CA, Oct. 31-Nov. 4, 1988
Conference
·
Thu Dec 31 23:00:00 EST 1987
·
OSTI ID:5920582
Related Subjects
36 MATERIALS SCIENCE
360000 -- Materials
42 ENGINEERING
420200* -- Engineering-- Facilities
Equipment
& Techniques
420800 -- Engineering-- Electronic Circuits & Devices-- (-1989)
ABSTRACTS
ALLOYS
ALUMINIUM ALLOYS
AMBIENT TEMPERATURE
CHEMICAL REACTIONS
COMPOSITE MATERIALS
CORROSION
CRYSTAL STRUCTURE
DOCUMENT TYPES
ELASTICITY
ELECTROCHEMICAL CORROSION
ENGINEERING
FAILURES
FATIGUE
FRACTURE MECHANICS
LEADING ABSTRACT
MATERIALS
MECHANICAL ENGINEERING
MECHANICAL PROPERTIES
MECHANICS
MEETINGS
MICROELECTRONICS
MICROSTRUCTURE
TEMPERATURE DEPENDENCE
TENSILE PROPERTIES
TESTING
USES
360000 -- Materials
42 ENGINEERING
420200* -- Engineering-- Facilities
Equipment
& Techniques
420800 -- Engineering-- Electronic Circuits & Devices-- (-1989)
ABSTRACTS
ALLOYS
ALUMINIUM ALLOYS
AMBIENT TEMPERATURE
CHEMICAL REACTIONS
COMPOSITE MATERIALS
CORROSION
CRYSTAL STRUCTURE
DOCUMENT TYPES
ELASTICITY
ELECTROCHEMICAL CORROSION
ENGINEERING
FAILURES
FATIGUE
FRACTURE MECHANICS
LEADING ABSTRACT
MATERIALS
MECHANICAL ENGINEERING
MECHANICAL PROPERTIES
MECHANICS
MEETINGS
MICROELECTRONICS
MICROSTRUCTURE
TEMPERATURE DEPENDENCE
TENSILE PROPERTIES
TESTING
USES