ISTFA 1986 - International Symposium for Testing and Failure Analysis; Proceedings of the Symposium, Los Angeles, CA, Oct. 20-24, 1986

Conference · Wed Jan 01 00:00:00 EST 1986

OSTI ID:5678996

The conference presents papers on the analysis of electronic materials, problems with electronic materials, EOS/ESD, new techniques, failure analysis results, test methods, failure modes and mechanisms, and the effect of microstructure on properties. Topics include the analysis of on-line organic microcontaminants in semiconductor assembly plants, the role of surface chemistry in packaging failures, the testing and analysis of photovoltaic modules for electrochemical corrosion, the reliability improvement and evaluation of TWTs for communications satellites, and the analysis of adhesive bond joint fractures by scanning electron fractography and X-ray emission spectroscopy. Consideration is also given to observers for failure detection of actuation systems, mechanisms governing the high strain fracture behavior of Al-Li-X alloys, and the effect of nonmetallic inclusions and test temperature on the fatigue life of cast C355, 354, and A206 aluminum.

• OSTI ID: 5678996
• Report Number(s): CONF-8610383-
• Resource Relation: Conference: International symposium for testing and failure analysis, Los Angeles, CA, USA, 20 Oct 1986
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
36 MATERIALS SCIENCE
FAILURES
MEETINGS
ALUMINIUM ALLOYS
AMBIENT TEMPERATURE
COMPOSITE MATERIALS
ELASTICITY
ELECTROCHEMICAL CORROSION
FATIGUE
FRACTURE MECHANICS
LEADING ABSTRACT
MECHANICAL ENGINEERING
MICROELECTRONICS
MICROSTRUCTURE
TEMPERATURE DEPENDENCE
TESTING
USES
ABSTRACTS
ALLOYS
CHEMICAL REACTIONS
CORROSION
CRYSTAL STRUCTURE
DOCUMENT TYPES
ENGINEERING
MATERIALS
MECHANICAL PROPERTIES
MECHANICS
TENSILE PROPERTIES
420200* - Engineering- Facilities
Equipment
& Techniques
420800 - Engineering- Electronic Circuits & Devices- (-1989)
360000 - Materials