Residual stress measurments of chromium films by x-ray diffraction, the sin/sup 2/psi method

Conference · Sun Jan 01 00:00:00 EST 1978

OSTI ID:6858254

Wong, S. M.

Residual stresses on chromium films vacuum deposited by electron beam on beryllium substrates were measured by x-ray diffraction. The minute peak shift of the diffraction profile reveals the presence of strain, hence stress. Shift detection was made possible by fitting experimental data to a modified Lorentz function and then subjecting the fit to a regression analysis. Computer aid was utilized extensively. Stresses, both tensile and compressive, and of magnitude between 10/sup 9/ to 10/sup 10/ dynes cm/sup -2/ were found for substrate temperatures in the range of 300 to 550/sup 0/C.

• Research Organization: Atomics International Div., Golden, Colo. (USA). Rocky Flats Plant
• DOE Contract Number: EY-76-C-04-3533
• OSTI ID: 6858254
• Report Number(s): RFP-2714; CONF-780430-4
• Resource Relation: Conference: Conference on metallurgical coatings, San Francisco, CA, USA, 3 Apr 1978
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
42 ENGINEERING
CHROMIUM
MATERIALS TESTING
FILMS
HIGH TEMPERATURE
RESIDUAL STRESSES
STRAINS
X-RAY DIFFRACTION
COHERENT SCATTERING
DIFFRACTION
ELEMENTS
METALS
SCATTERING
STRESSES
TESTING
TRANSITION ELEMENTS
360103* - Metals & Alloys- Mechanical Properties
420500 - Engineering- Materials Testing