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U.S. Department of Energy
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Effects of radiation on microelectronics and techniques for hardening

Conference ·
OSTI ID:6809845
Total dose damage, displacement damage, and single particle events can cause microelectronic circuits to cease to function properly. The tolerance of an integrated circuit to radiation damage can be affected by a large number of factors, including the irradiation conditions, postirradiation conditions, transistor characteristics, and circuit design. Improvements in hardness can be achieved by proper fabrication techniques (including minimization of gate oxide thickness, processing temperatures, and the use of hydrogen for MOS devices) and appropriate design considerations. 23 refs., 5 figs.
Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6809845
Report Number(s):
SAND-88-2722C; CONF-881151-10; ON: TI89001227
Country of Publication:
United States
Language:
English