1/f Noise and radiation effects in MOS devices
- Sandia National Labs., Albuquerque, NM (United States)
- Oberlin College, OH (United States). Physics Dept.
An extensive comparison of the 1/f noise and radiation response of MOS devices is presented. Variations in the room-temperature 1/f noise of unirradiated transistors in the linear regime of device operation correlate strongly with variations in post irradiation threshold-voltage shifts due to oxide-trap charge. A simple number fluctuation model has been developed to semi-quantitatively account for this correlation. The 1/f noise of irradiated n-channel MOS transistors increases during irradiation with increasing oxide-trap charge and decreases during post irradiation positive-bias annealing with decreasing oxide-trap charge. No such correlation is found between low-frequency 1/f noise and interface-trap charge. The noise of irradiated p-channel MOS transistors also increases during irradiation, but in contrast to the n-channel response, the p-channel transistor noise magnitude increases during positive-bias annealing with decreasing oxide-trap charge. A qualitative model involving the electrostatic charging and discharging of border traps, as well as accompanying changes in trap energy, is developed to account for this difference in n- and p-channel post irradiation annealing response. 116 refs.
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 6795788
- Journal Information:
- IEEE Transactions on Electron Devices (Institute of Electrical and Electronics Engineers); (United States), Vol. 41:11; ISSN 0018-9383
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
42 ENGINEERING
MOS TRANSISTORS
NOISE
PHYSICAL RADIATION EFFECTS
CRYSTAL DEFECTS
ELECTRICAL PROPERTIES
MATHEMATICAL MODELS
TRAPS
CRYSTAL STRUCTURE
PHYSICAL PROPERTIES
RADIATION EFFECTS
SEMICONDUCTOR DEVICES
TRANSISTORS
440200* - Radiation Effects on Instrument Components
Instruments
or Electronic Systems
426000 - Engineering- Components
Electron Devices & Circuits- (1990-)