Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Atomic interdiffusion in Au/amorphous NiNb/semiconductor systems

Conference ·
OSTI ID:6714615
Backscattering measurements were performed to assess the stability of amorphous NiNb for contacts of high temperature electronics. The interdiffusion of amorphous NiNb and three semiconductors - Si, GaAs and GaP - was measured to study the stability for primary metallization applications. Diffusion of Au with amorphous NiNb and the same three semiconductors were also investigated in order to address diffusion barrier applications of amorphous metals. Results indicate that the use of amorphous NiNb as a contact or a diffusion barrier could extend the useful operation temperature range for GaP devices to above 550/sup 0/C. 6 figures.
Research Organization:
Sandia National Labs., Albuquerque, NM (USA); Wisconsin Univ., Madison (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6714615
Report Number(s):
SAND-82-1587C; CONF-821107-20; ON: DE83002553
Country of Publication:
United States
Language:
English