Porosity in collapsible Ball Grid Array solder joints
- Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Mineral Engineering
Ball Grid Array (BGA) technology has taken off in recent years due to the increased need for high interconnect density. Opposite to all the advantages BGA packages offer, porosity in collapsible BGA solder joints is often a major concern in the reliability of such packages. The effect of pores on the strength of collapsible BGA solder-joints was studied by manufacturing samples with different degrees of porosity and testing them under a shear load. It was found that the shear strength of the solder joints decreased in a linear fashion with increasing porosity. Failure occurred by internal necking of the interpore matrix. It was confirmed that entrapment of flux residues leads to porosity by manufacturing fluxless samples in a specially made furnace, and comparing them with samples assembled using flux. Also, contamination of Au electrodeposits (in substrate metallization) was determined to cause significant porosity. It was found that hard-Au (Co hardened Au) electrodeposits produce high degrees of porosity even in the absence of flux. Finally, increasing the time the solder spends in the molten state was proven to successfully decrease porosity.
- Research Organization:
- Lawrence Berkeley National Lab., Materials Science Div., Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Office of Energy Research, Washington, DC (United States)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 663270
- Report Number(s):
- LBNL--42052; ON: DE98059380
- Country of Publication:
- United States
- Language:
- English
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