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Microstructural evaluation of strained multilayer InAsSb/InSb infrared detectors by transmission electron microscopy

Journal Article · · Journal of Applied Physics; (United States)
DOI:https://doi.org/10.1063/1.352802· OSTI ID:6630690
;  [1];  [2]
  1. Department of Chemical Engineering, University of New Mexico, Albuquerque, New Mexico 87131 (United States)
  2. Sandia National Laboratories, Albuquerque, New Mexico 87185 (United States)
InSb/InAsSb strained layer superlattices (SLS) were grown on (001) InSb substrates by molecular beam epitaxy at 425 [degree]C. The active device consisted of an InAs[sub 0.15]Sb[sub 0.85]/InSb superlattice region embedded within a [ital p]-[ital i]-[ital n] junction. The large lattice mismatch between the active device and the substrate required the growth of a buffer. InAs[sub 0.15]Sb[sub 0.85]/InSb SLS, where the average As content was gradually increased, was used as a buffer. The buffer structure was varied to probe its microstructural effect on the capping device. Three distinct approaches (A, B, and C) were used to grow the buffer. Approach A was a four-step buffer where the average content of As in the superlattice was increased in four equal composition steps. This approach led to a crystal with an extensive network of threading dislocations and microcracks. Approach B was to change the average composition in five equal composition steps, thereby decreasing the misfit at the interfaces between composition steps. This led to a decrease in the threading dislocation density but microscopic cracks were still evident. The last approach (C) was to employ migration enhanced epitaxy (MEE) for the growth of the five-step buffer. Samples grown by employing MEE revealed no microcracks but they contained a high density of unusual wiggly'' dislocations at the buffer/device interface. Detailed microstructural analysis by transmission electron microscopy is presented.
OSTI ID:
6630690
Journal Information:
Journal of Applied Physics; (United States), Journal Name: Journal of Applied Physics; (United States) Vol. 73:9; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English