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Title: Scanning transmission electron microscopy/energy-dispersive X-ray analysis of metal fusible links in programmable read only memory integrated circuits

Journal Article · · Scanning Electron Microsc.; (United States)
OSTI ID:6606252

Evaporated Ni-Cr and sputtered Ti-W-N fusible links have been analyzed before and after programming. STEM analysis allows the fuse to be examined without the removal of passivation layers and provides the resolution necessary to examine material in the fuse gap. STEM/EDX probing has revealed a Ti-rich residue in the fuse gap and W-rich droplets at the gap edge in the Ti-W-N fuses. Vertical sections have revealed a variation in the Ni-/Cr ratio as a function of the film depth with a Ni-rich region at the upper surface and a Cr-rich zone at the lower surface.

Research Organization:
Philips Research Labs., Signetics Corp., Sunnyvale, CA 94086
OSTI ID:
6606252
Journal Information:
Scanning Electron Microsc.; (United States), Vol. 000084:2
Country of Publication:
United States
Language:
English