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Total dose response of transconductance in MOSFETs at low temperature

Conference · · IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States)
OSTI ID:6598082
 [1]; ; ;  [2];  [3]
  1. RLP Research, Inc., Albuquerque, NM (United States)
  2. Naval Surface Warfare Center, Crane, IN (United States)
  3. S-Cubed, Mission Viejo, CA (United States)

N and p channel MOSFETs from four bulk CMOS technologies and two CMOS/SIMOX technologies were characterized for total dose response up to 1 Mrad (SiO[sub 2]) at temperatures from 10K to 120K. The peak transconductance in the linear region increased in n channel devices and decreased in p channel devices for devices with lightly doped drain (LDD) implants. These changes were much larger as the temperature was decreased and were as much as a factor of 50 in p MOSFETs at 10K. The one technology without LDD showed only a minor change in g[sub m] with dose even at 10K. The changes in transconductance are most likely a result of hole trapping in the spacer oxide affecting the series resistance.

OSTI ID:
6598082
Report Number(s):
CONF-930953--
Journal Information:
IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States), Journal Name: IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States) Vol. 41:3Pt1; ISSN 0018-9499; ISSN IETNAE
Country of Publication:
United States
Language:
English