Investigation of materials and bonding using the scanning laser acoustic microscope: Final report
Technical Report
·
OSTI ID:6593524
The Scanning Laser Acoustic Microscope (SLAM) is a relatively new instrument which uses properties of acoustic wave propagation to examine various material samples. Internal defects such as cracks, delaminations, voids, and inclusions can be detected nondestructively and on a real-time basis. For this reason, the SLAM system may serve as a potential replacement in situations that now call for destructive physical analysis. A considerable amount of training is necessary to enable a prospective SLAM operator to understand the complete system operation and capabilities. In addition, a considerable amount of experience is needed for an operator to evaluate the results obtained. However, with enough training and experience, a SLAM operator can identify a variety of defects; these would include defective hermetic seals on leadless hermetic packages, voids or delaminations in cermaic chip capacitors, incomplete die attachment to chip carriers, and cracks in Mn-Zn ferrites. 4 refs., 12 figs., 1 tab.
- Research Organization:
- Allied-Signal Aerospace Co., Kansas City, MO (USA). Kansas City Div.
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6593524
- Report Number(s):
- KCP-613-4033; ON: DE89004435
- Country of Publication:
- United States
- Language:
- English
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