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CMOS hardness assurance through process controls and optimized design procedures

Conference · · IEEE Trans. Nucl. Sci.; (United States)
OSTI ID:6545887
Total Dose Hardness Assurance for complimentary MOS integrated circuits is recognized throughout the industry as a difficult problem. Most of the hardness assurance proposals to date have included a large amount of radiation testing on a diffusion lot or wafer basis to help guarantee the hardness of a small group of integrated circuits. This, in general, is very expensive, and alternate techniques must be explored. This paper discusses the use of process and device parameter controls along with optimized design procedures for radiation hardness to minimize the need for frequent radiation testing. Total dose data up to 1 x 10/sup 6/ Rads-Si are presented for several metal gate CMOS diffusion lots which demonstrate the reproducibility obtained when these control and design procedures are implemented.
Research Organization:
Harris Semiconductor, Melbourne, FL
OSTI ID:
6545887
Conference Information:
Journal Name: IEEE Trans. Nucl. Sci.; (United States) Journal Volume: NS-24:6
Country of Publication:
United States
Language:
English