The integration of surface micromachined devices with optoelectronics: Technology and applications
Sandia National Laboratories has a substantial effort in development of microelectromechanical system (MEMS) technologies. This miniaturization capability can lead to low-cost, small, high-performance systems-on-a-chip, and have many applications ranging from advanced military systems to large-volume commercial markets like automobiles, rf or land-based communications networks and equipment, or commercial electronics. One of the key challenges in realization of the microsystem is integration of several technologies including digital electronics; analog and rf electronics, optoelectronics, sensors and actuators, and advanced packaging technologies. In this work they describe efforts in integrating MEMS and optoelectronic or photonic functions and the fabrication constraints on both system components. the MEMS technology used in this work are silicon surface-machined systems fabricated using the SUMMiT (Sandia Ultraplanar Multilevel MEMS Technology) process developed at Sandia. This process includes chemical-mechanical polishing as an intermediate planarization step to allow the use of 4 or 5 levels of polysilicon.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 654188
- Report Number(s):
- SAND--98-0913C; CONF-980720--; ON: DE98004951; BR: DP0102022
- Country of Publication:
- United States
- Language:
- English
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