Solid state bonding of beryllium-copper for an ITER first wall application
Several different joint assemblies were evaluated in support of a manufacturing technology for diffusion bonding a beryllium armor tile to a copper alloy heat sink for fusion reactor applications. Because beryllium reacts with all but a few elements to form intermetallic compounds, this study considered several different surface treatments as a means of both inhibiting these reactions and promoting a good diffusion bond between the two substrates. A diffusion bonded assemblies used aluminum or an aluminum-beryllium composite (AlBeMet-150) as the interfacial material in contact with beryllium. In most cases, explosive bonding was utilized as a technique for joining the copper alloy heat sink to an aluminum or AlBeMet-150 substrate, which was subsequently diffusion bonded to an aluminum coated beryllium tile. In this approach, a 250 {micro}m thick titanium foil was used as a diffusion barrier between the copper and aluminum to prevent the formation of Cu-Al intermetallic phases. In all cases, a hot isostatic pressing (HIP) furnace was used in conjunction with canned assemblies in order to minimize oxidation and apply sufficient pressure on the assembly for excellent metal-to-metal contact and subsequent bonding. Several different processing schedules were evaluated during the course of this study; bonded assemblies were produced that failed outside the bond area indicating a 100% joint efficiency.
- Research Organization:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE Office of Energy Research, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 654126
- Report Number(s):
- SAND-97-8637; CONF-9710153-; ON: DE98052602; TRN: 98:010155
- Resource Relation:
- Conference: 3. IEA international workshop on beryllium technology for fusion, Mito (Japan), 22-24 Oct 1997; Other Information: PBD: Feb 1998
- Country of Publication:
- United States
- Language:
- English
Similar Records
Preliminary characterization of interlayer for Be/Cu sintered compacts
Thermal fatigue testing of a diffusion-bonded beryllium divertor mock-up under ITER relevant conditions