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Thermal fatigue testing of a diffusion-bonded beryllium divertor mock-up under ITER relevant conditions

Conference ·
OSTI ID:123262
 [1];  [2];  [3]
  1. Pennsylvania State Univ., University Park, PA (United States)
  2. D.V. Efremov Scientific Research Institute of Electrophysical Apparatus, St. Petersburg (Russian Federation)
  3. Sandia National Labs., Albuquerque, NM (United States); and others

Thermal response and thermal fatigue tests of four 5 mm thick beryllium tiles on a Russian divertor mock-up were completed on the Electron Beam Test System at Sandia National Laboratories. The beryllium tiles were diffusion bonded onto an OFHC copper saddleblock and a DSCu (MAGT) tube containing a porous coating. Thermal response tests were performed on the tiles to an absorbed heat flux of 5 MW/m{sup 2} and surface temperatures near 300{degrees}C using 1.4 MPa water at 5.0 m/s flow velocity and an inlet temperature of 8-15{degrees}C. One tile was exposed to incrementally increasing heat fluxes up to 9.5 MW/m{sup 2} and surface temperatures up to 690{degrees}C before debonding at 10 MW/m{sup 2}. A third tile debonded after 9200 thermal fatigue cycles at 5 MW/m{sup 2}, while another debonded after 6800 cycles. In all cases, fatigue failure occurred in the intermetallic layers between the beryllium and copper. No fatigue cracking of the bulk beryllium was observed. During thermal cycling, a gradual loss of porous coating produced increasing sample temperatures. These experiments indicate that diffusion-bonded beryllium tiles can survive several thousand thermal cycles under ITER relevant conditions without failure. However, the reliability of the diffusion bonded Joint remains a serious issue.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
123262
Report Number(s):
SAND--95-2325C; CONF-940843--19; ON: DE96001943
Country of Publication:
United States
Language:
English

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