Thermal electron attachment to SF/sub 4/

Journal Article · Thu Apr 15 04:00:00 EST 1982 · J. Phys. Chem.; (United States)

DOI:https://doi.org/10.1021/j100397a003· OSTI ID:6523044

Babcock, L M; Streit, G E

Using the flowing afterglow technique at ambient temperatures, the rate at which SF/sub 4/ attaches thermal electrons in a He buffer gas was found to be k = (1.5 +- 0.5) x 10/sup -9/ cm/sup 3/ molecule/sup -1/ s/sup -1/. The attachment rate is independent of pressure in the range 0.29 to 0.50 torr. This indicates that the excited (SF/sub 4//sup -/)* has a lifetime against autodetachment which is greater than the longest time between collisions (that is, longer than the time between collisions at P = 0.29 torr). If the collision frequency is taken to be the Langevin rate for the (SF/sub 4//sup -/)*-He pair, this predicts that the lifetime of (SF/sub 4//sup -/)* against autodetachment is greater than 0.2 ..mu..s: tau/sub a/ > 0.2 ..mu..s.

• Research Organization: Los Alamos National Lab., NM
• OSTI ID: 6523044
• Journal Information: J. Phys. Chem.; (United States), Journal Name: J. Phys. Chem.; (United States) Vol. 86:8; ISSN JPCHA
• Country of Publication: United States
• Language: English

Related Subjects

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
400201 -- Chemical & Physicochemical Properties
640304* -- Atomic
Molecular & Chemical Physics-- Collision Phenomena
74 ATOMIC AND MOLECULAR PHYSICS
CHEMICAL REACTION KINETICS
ELECTRON ATTACHMENT
FLUORIDES
FLUORINE COMPOUNDS
HALIDES
HALOGEN COMPOUNDS
KINETICS
REACTION KINETICS
SULFUR COMPOUNDS
SULFUR FLUORIDES