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Shock compression temperature rise determined from resistivity of embedded metal foils. [Polymethyl methacrylate]

Conference ·
OSTI ID:6522370
;

The temperature rise induced by shock compression of polymethyl methacrylate (PMMA) was determined from measurements of the electrical resistivity of embedded copper foils. The temperature of the copper was determined from the observed foil resistance and known values of the change in copper resistivity with temperature and shock compression. Temperature values obtained over a stress range from 0.9 to 6.0 GPa are in good agreement with thermocouple measurements reported previously.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6522370
Report Number(s):
SAND-80-2836C; CONF-810684-11; ON: DE81024083
Country of Publication:
United States
Language:
English

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Related Subjects

36 MATERIALS SCIENCE
360400* -- Polymers & Plastics-- (-1987)
CARBOXYLIC ACIDS
COMPRESSION
COPPER
ELECTRIC CONDUCTIVITY
ELECTRICAL PROPERTIES
ELEMENTS
ESTERS
FOILS
HEATING
METALS
METHACRYLIC ACID
MONOCARBOXYLIC ACIDS
ORGANIC ACIDS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PHYSICAL PROPERTIES
POLYACRYLATES
POLYMERS
POLYVINYLS
SHOCK WAVES
TEMPERATURE MEASUREMENT
TRANSITION ELEMENTS