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Correlations of the growth, structure and stress with the adhesion of diamond films on tungsten

Conference ·
OSTI ID:6486899
 [1]; ; ;  [2]
  1. New Mexico Inst. of Mining and Technology, Socorro, NM (United States). Dept. of Materials Engineering
  2. Sandia National Labs., Albuquerque, NM (United States)

Diamond films were deposited on tungsten substrates by a filament-assisted chemical vapor deposition process as a function of seven different processing parameters. The effect of variations in measured film characteristics such as growth rate, texture, diamond-to-nondiamond carbon Raman band intensity ratio and strain on the adhesion between the diamond film/tungsten substrate pairs as measured by a tensile pull method were investigated. The measured adhesion values do not correlate with any of the measured film characteristics mentioned above. The problem arises because of the non-reproducibility of the adhesion test results, due to the non-uniformity of film thickness, surface preparation and structural homogeneity across the full area of the substrate.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
DOE; USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6486899
Report Number(s):
SAND-93-0826C; CONF-930419--1; ON: DE93012855
Country of Publication:
United States
Language:
English