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Nb and Nb-based A15 compound tunnel junctions fabricated using a new CF/sub 4/ cleaning process

Conference · · IEEE Trans. Magn.; (United States)
OSTI ID:6484952

A new surface cleaning technique, the CF/sub 4/ Cleaning Process (CFCP), is proposed for the fabrication of Nb and Nb-based A15 compound tunnel junctions with native oxide barriers. The effects of fabrication conditions and these superconducting material properties on the characteristics of these junctions with Pb or Pb alloy counterelectrodes are investigated. High-quality junctions with a well-defined gap, no knee and very low excess conductance are successfully fabricated through the conventional lift-off technique for A15 compounds (Nb/sub 3/A1, Nb/sub 3/Ge and Nb/sub 3/Si) as well as Nb. Arrays of 100 series-connected 2 ..mu..m/phi/ Nb/PbBi junctions are fabricated with the standard deviation (sigma) of critical current (J /SUB c/ = 15.1 KA/cm/sup 2/) equal to 2.5%. The CFCP mechanism that contributes to the formation of such good junctions is studied using in-situ X-ray photoelectron spectroscopy (XPS). Chemical shifts of the Nb 3d levels on the CF/sub 4/ plasma-cleaned Nb surfaces indicate the presence of an Nb-F layer. These XPS spectra show that the tunnel barrier is composed of mixed Nb/sub 2/O/sub 5/ and Nb-F-O compounds.

Research Organization:
Ibaraki Electrical Communication Laboratory, NTT, Tokai, Ibaraki
OSTI ID:
6484952
Report Number(s):
CONF-840937-
Journal Information:
IEEE Trans. Magn.; (United States), Journal Name: IEEE Trans. Magn.; (United States) Vol. MAG 21:2; ISSN IEMGA
Country of Publication:
United States
Language:
English