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Title: GaAs/Al/sub 0. 3/Ga/sub 0. 7/As, heterojunction bipolar transistors for high-temperature (T > 300/sup 0/C), power electronic applications

Conference ·
OSTI ID:6473646

Solid-state devices formed from compound semiconductor materials like GaAs, GaP, SiC, and (Al,Ga)As have long been viewed as candidates for use in electronic circuits functioning at temperatures greater than 300/sup 0/C. To address the specific needs of power semiconductor devices operating simultaneously at high currents, voltages, and high temperatures, heterojunction devices formed from combinations of GaAs and (Al,Ga)As have recently been proposed. These novel heterojunction structures display reduced resistive and voltage parasitics when compared to wide-bandgap GaP or SiC, homojunction diodes without seriously compromising control of thermally generated leakage currents. In this study, a prototype, low-power, (Al,Ga)As/GaAs, heterojunction bipolar transistor (HBT) is described which has demonstrated excellent electrical characteristics in the 300 to 400/sup 0/C temperature range. At 350/sup 0/C, the HBT has a common-emitter current gain of 14 (V/sub CE/ = 5V, I/sub C/ = 10 mA) and collector-base leakage of 6.4 x 10/sup -2/ A/cm/sup 2/ (V/sub CB/ = 5 V).

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6473646
Report Number(s):
SAND-87-1632C; CONF-870679-1; ON: DE87011320
Resource Relation:
Conference: 5. symposium on energy engineering sciences, Argonne, IL, USA, 17 Jun 1987; Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English